Abstract:

Develop advanced thermal management methods and systems that will allow next-generation power electronics to operate at high heat fluxes and high temperatures in a compact (low volume), lightweight power electronics package. Analyze the cooling and thermal control technology currently used in state-of-the-art insulated gate bipolar transistors (IGBTs) for high power applications, such as in automotive traction drives. Explore variety of improved options for cooling within given manufacturing constraints. Provide recommendations to manufacturers to accommodate improved flow and thermal behavior of cooling systems. Test and validate improvements when prototypes are available.

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